Measuring stress next to Au ball bond during high temperature aging

The Changing Automotive Environment: High-Temperature Electronics

Wayne Johnson, John L. Evans, Peter Jacobsen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 854 citations

Engineering, Automotive Engineering, Electrical Engineering +17

Introduction to the Mechanics of Solids

D S Dugdale · Physics Bulletin · 1967 · 400 citations

Engineering, Materials Engineering, Materials Science +15

Silicon piezoresistive stress sensors and their application in electronic packaging

Jeffrey C. Suhling, R.C. Jaeger · IEEE Sensors Journal · 2001 · 274 citations

Engineering, Electrical Engineering, Materials Science +17

Strength and sharp contact fracture of silicon

Robert F. Cook · Journal of Materials Science · 2006 · 206 citations

Engineering, Materials Engineering, Materials Science +10

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

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Engineering, Electrical Engineering, Materials Science +17