J.T. Moon

In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

A. Shah, M. Mayer, Y. Zhou et al. · Microelectronic Engineering · 2008 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +13

Investigation of recrystallization and grain growth of copper and gold bonding wires

Jae‐Hyung Cho, K. H. Oh, Anthony D. Rollett et al. · Metallurgical and Materials Transactions A · 2006 · 49 citations

Engineering, Materials Engineering, Materials Science +14

Recrystallization and grain growth of cold-drawn gold bonding wire

J. H. Cho, Yeon Wook Kim, K. H. Oh et al. · Metallurgical and Materials Transactions A · 2003 · 48 citations

Natural Sciences, Materials Engineering, Materials Science +14

Low-Stress Thermosonic Copper Ball Bonding

A. Shah, M. Mayer, Y. Zhou et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force

C.J. Hang, W.H. Song, I. Lum et al. · Microelectronic Engineering · 2009 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +10