Publication | Closed Access
Investigation of recrystallization and grain growth of copper and gold bonding wires
49
Citations
16
References
2006
Year
Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationCorrosionGrain GrowthApplied PhysicsMetallurgical InteractionMetallurgical SystemGold Bonding WiresCladding (Metalworking)MicrostructureMetal Processing
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