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The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

DOI

24

Citations

10

References

2012

Year

Yu‐Wei Lin, Ren-You Wang, Wun-Bin Ke, I-Sheng Wang, Ying-Ta Chiu, Kuo‐Chang Lu, Kwang‐Lung Lin, Yi‐Shao Lai
Materials Science and Engineering A

References

YearCitations

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