Journal of Pharmacy And Bioallied Sciences · 2013 · 148 citations · 1 references
PharmacyPharmaceuticsPackaging DesignPharmaceutical PackagingPharmaceutical TechnologyChild-resistant PackagingMedication PackagingPackaging EngineeringPackaging MaterialsPharmaceutical Packaging DesignUnit-dose PackagingBlow-fill-seal TechnologyChild-resistant ContainersDosage Form PackagingPharmaceutical Packaging MaterialsPlasma-assisted Chemical Vapor DepositionPlasma-enhanced Chemical Vapor DepositionUnit-dose BottlesUnit-dose Child-resistant Packaging
The pharmaceutical packaging market, worth over $20 billion annually, is growing at least five percent per year and is shaped by innovations such as BFS vials, anti‑counterfeiting measures, and child‑resistant packs that require reliable, rapid, and secure packaging solutions. This review aims to detail recent packaging trends impacting the industry and to offer predictions for its future. The authors conduct a comprehensive review of recent packaging innovations and their effects on product protection, quality, tamper evidence, patient comfort, and security.
The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.
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Coatings on plastics with the PICVD technology
M. Kuhr, Stefan Bauer, U. Rothhaar et al. · Thin Solid Films · 2003 · 88 citations
Natural Sciences, Materials Engineering, Materials Science +12