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Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Materials ScienceEngineeringMicrofabricationAdhesive MaterialMechanical EngineeringRheological PropertyChip AttachmentRheologyRheology ControlElectronic PackagingRheological CharacterisationSolder PastesFlip-chip AssemblyStructural Adhesive