Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Engineering solder paste performance through controlled stress rheology analysis

Xiaohua Bao, Ning‐Cheng Lee, Rajkumar B. Raj et al. · Soldering and Surface Mount Technology · 1998 · 58 citations

Engineering, Materials Engineering, Materials Science +14

PARAMETER INTERACTIONS IN STENCIL PRINTING OF SOLDER PASTE

L. Haslehurst, N.N. Ekere · Journal of Electronics Manufacturing · 1996 · 45 citations

Engineering, Materials Engineering, Materials Science +11

Computer simulation of solder paste flow Part II: Flow out of a stencil aperture

S.H. Mannan, N.N. Ekere, Ismayadi Ismail et al. · Journal of Electronics Manufacturing · 1994 · 18 citations

Engineering, Materials Engineering, Computational Fluid Dynamics +8

Process Modelling Maps for Solder Paste Printing

N.N. Ekere, E.K. Lo, S.H. Mannan · Soldering and Surface Mount Technology · 1994 · 18 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +12

Computer simulation of solder paste flow Part I: Dense suspension theory

S.H. Mannan, N.N. Ekere, Ismayadi Ismail et al. · Journal of Electronics Manufacturing · 1994 · 17 citations

Engineering, Materials Engineering, Materials Science +10