Concepedia
Statistics
Publications
5
Citations
111
H-Index
Active since
2006
Affiliations
University of Greenwich(Current)
Universiti Tunku Abdul Rahman
Tunku Abdul Rahman University of Management and Technology
A.E. Marks is an author at University of Greenwich specializing in solder pastes, materials science, and engineering.
Publications per year
2006–2009
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
R. Durairaj, Sabuj Mallik, Anasyida Abu Seman et al. · Journal of Materials Processing Technology · 2008 · 58 citations
Engineering, Materials Engineering, Materials Science +13
Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications
Sabuj Mallik, N.N. Ekere, R. Durairaj et al. · Materials & Design (1980-2015) · 2009 · 15 citations
Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications
Sabuj Mallik, N.N. Ekere, A.E. Marks et al. · 2008 · 13 citations
Modeling the Structural Breakdown of Solder Paste Using the Structural Kinetic Model
Sabuj Mallik, N.N. Ekere, A.E. Marks et al. · Journal of Materials Engineering and Performance · 2009 · 13 citations
Rheological Characterisation of New Lead-Free Solder Paste Formulations for Flip-Chip Assembly
R. Durairaj, Sabuj Mallik, A.E. Marks et al. · 2006 1st Electronic Systemintegration Technology Conference · 2006 · 12 citations
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