Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +14

Bismuth-induced embrittlement of copper grain boundaries

Gerd Duscher, Matthew F. Chisholm, U. Alber et al. · Nature Materials · 2004 · 292 citations

Natural Sciences, Materials Engineering, Materials Science +12

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Bismuth embrittlement of copper is an atomic size effect

R. Schweinfest, A. T. Paxton, Michael W. Finnis · Nature · 2004 · 197 citations

Natural Sciences, Materials Engineering, Materials Science +10

The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints

Wenge Yang, L.E. Felton, Robert W. Messler · Journal of Electronic Materials · 1995 · 151 citations

Natural Sciences, Materials Engineering, Materials Science +13