Concepedia

Zhixian Min

ZM

Statistics

Publications

17

Citations

578

H-Index

14

Active since

2008

Affiliations

China Electronics Technology Group Corporation(Current)

Nanchang University

Northwestern Polytechnical University

Jiangxi Academy of Sciences

Zhixian Min is an author at China Electronics Technology Group Corporation specializing in materials science, materials engineering, and metals.

Publications per year

2008–2019

17

Publications

17

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Xiaowu Hu, Yulong Li, Zhixian Min · Journal of Alloys and Compounds · 2013 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +14

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Xiaowu Hu, Yulong Li, Yi Liu et al. · Journal of Alloys and Compounds · 2014 · 82 citations

Engineering, Materials Engineering, Materials Science +12

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Xiaowu Hu, Yulong Li, Yong Liu et al. · Microelectronics Reliability · 2014 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

Xiaowu Hu, Ke Li, Zhixian Min · Journal of Alloys and Compounds · 2013 · 52 citations

Engineering, Materials Engineering, Materials Science +17

Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Xiaowu Hu, Yulong Li, Zhixian Min · Journal of Materials Science Materials in Electronics · 2013 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +17

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