Concepedia

Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

Nadim Alayli, Armelle Girard, Ky-Lim Tan, Pierre‐Richard Dahoo

Materials Chemistry and Physics · 2014 · 31 citations · 26 references

DOI

Concepts

References

26

X-ray line broadening from filed aluminium and wolfram

G.K. Williamson, W H Hall · Acta Metallurgica · 1953 · 10.2K citations

, , +5

Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500 K

Yasumasa Okada, Yozo Tokumaru · Journal of Applied Physics · 1984 · 1.2K citations

, , +17

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

, , +17

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Kim S. Siow · Journal of Electronic Materials · 2014 · 312 citations · Full text

, , +16

Spark plasma sintering of alumina: Study of parameters, formal sintering analysis and hypotheses on the mechanism(s) involved in densification and grain growth

Julien Gurt Santanach, Alicia Weibel, Claude Estournès et al. · Acta Materialia · 2010 · 216 citations

, , +16