IEEE Transactions on Magnetics · 1973 · 20 citations · 9 references
EngineeringElectrical EngineeringMagnetic MaterialsMicroelectronicsMicrofabricationIntegrated Circuit DesignMemory DevicesModular DesignModule ArchitectureModule DesignMultichip ModulesTechnical Feasibility
An experimental magnetic bubble mass memory design is reported. The goal of this project has been to examine the technical feasibility of organizing a multiplicity of chips into a modular design and to learn some of the problems. The module consists of four ceramic substrates, each of which can mount from 1 to 14 chips of up to 20 kbit capacity. 1 to 4 of these populated substrates can be placed into a common drive coil-bias field magnet assembly. The module organization and timing is described and data obtained from the operation of 20 kbit chips at 112 kHz rotating field is given.
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Application of orthoferrites to domain-wall devices
A. H. Bobeck, R. Fischer, A. J. Perneski et al. · IEEE Transactions on Magnetics · 1969 · 192 citations
Natural Sciences, Materials Engineering, Materials Science +14
Applications of bubble devices
P. Bonyhard, I. Danylchuk, D.J. Kish et al. · IEEE Transactions on Magnetics · 1970 · 55 citations
Engineering, Computer Engineering, Electrical Engineering +16
Magnetic bubble memory chip design
P. Bonyhard, J. E. Geusic, A. H. Bobeck et al. · IEEE Transactions on Magnetics · 1973 · 51 citations
Engineering, Computer Engineering, Electrical Engineering +15
A self-contained magnetic bubble-domain memory chip
Hsu Chang, Jacob A Fox, Daniel Lu et al. · IEEE Transactions on Magnetics · 1972 · 33 citations
Engineering, Computer Engineering, Electrical Engineering +13