Effects of bonding frequency on Au wedge wire bondability

Effects of bonding force on contact pressure and frictional energy in wire bonding

Yong Ding, Jang‐Kyo Kim, Pin Tong · Microelectronics Reliability · 2005 · 32 citations

Engineering, Materials Engineering, Materials Science +16

Effects of metallization characteristics on gold wire bondability of organic printed circuit boards

Jang‐Kyo Kim, Benny P. L. Au · Journal of Electronic Materials · 2001 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Yu Hin Chan, Jang‐Kyo Kim, Deming Liu et al. · IEEE Transactions on Advanced Packaging · 2005 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

Advanced process characterization for 125 kHz wire bonder ultrasonic transducers

L Parrini · IEEE Transactions on Components and Packaging Technologies · 2002 · 18 citations

Engineering, Materials Engineering, Mechanical Engineering +15

Process windows for low-temperature Au wire bonding

Yu Hin Chan, Jang‐Kyo Kim, Deming Liu et al. · Journal of Electronic Materials · 2004 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +11