Characterization of ageing failures on power MOSFET devices by electron and ion microscopies

Selected failure mechanisms of modern power modules

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Crack-like grain-boundary diffusion wedges in thin metal films

Huajian Gao, L. Zhang, William D. Nix et al. · Acta Materialia · 1999 · 207 citations

Natural Sciences, Materials Engineering, Materials Science +17

Experimental Behavior of Single-Chip IGBT and COOLMOS Devices Under Repetitive Short-Circuit Conditions

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Engineering, Electrical Engineering, Materials Science +17

Reliability aspects of microsensors and micromechatronic actuators for automotive applications

Roland Müller‐Fiedler, Volker Knoblauch · Microelectronics Reliability · 2003 · 60 citations

Engineering, Automotive Engineering, Mechatronics Engineering +16

In situ deformation of thin films on substrates

M. Legros, Martiane Cabié, Daniel S. Gianola · Microscopy Research and Technique · 2009 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +17