Publication | Closed Access
Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method
16
Citations
5
References
1996
Year
Materials ScienceEngineeringSurface ScienceApplied PhysicsCopper FilmsIon BeamVapor DepositionThin FilmsChemical DepositionChemical Vapor DepositionThin Film Processing
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