Publication | Closed Access
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
14
Citations
12
References
2004
Year
Electrical EngineeringElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)Electronic PackagingMicroelectronicsReliability PerformancePost-etch Wet CleanCu/low K InterconnectionsElectrical Insulation
| Year | Citations | |
|---|---|---|
Page 1
Page 1