Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates - Concepedia

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Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

48

Citations

14

References

2005

Year

M.J. Rizvi, Y.C. Chan, C. Bailey, Hua Lu, Mobinul Islam, Bin Wu

Journal of Electronic Materials

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringCorrosionSurface ScienceApplied PhysicsNi SubstratesSn-2.8ag-0.5cu-1.0bi SolderMetallurgical ProcessElectronic Packaging

References

	Year	Citations

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