Fabrication, RF characteristics and mechanical stability of self-assembled 3D microwave inductors

Integrated circuit technology options for RFICs-present status and future directions

L.E. Larson · IEEE Journal of Solid-State Circuits · 1998 · 235 citations

Engineering, Electrical Engineering, Microelectronics +16

Multilevel-spiral inductors using VLSI interconnect technology

Joachim N. Burghartz, K.A. Jenkins, M. Soyuer · IEEE Electron Device Letters · 1996 · 143 citations

Engineering, Computer Engineering, Electrical Engineering +17

Surface tension powered self-assembly of 3-D micro-optomechanical structures

R.R.A. Syms · Journal of Microelectromechanical Systems · 1999 · 111 citations

Engineering, Manufacturing Engineering, Materials Engineering +15

Demonstration of three-dimensional microstructure self-assembly

P.W. Green, R.R.A. Syms, Eric M. Yeatman · Journal of Microelectromechanical Systems · 1995 · 99 citations

Engineering, Materials Engineering, Materials Science +12

Self-assembly of three-dimensional microstructures using rotation by surface tension forces

R.R.A. Syms, Eric M. Yeatman · Electronics Letters · 1993 · 92 citations

Engineering, Materials Engineering, Materials Science +15