Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

Modelling of transient liquid phase bonding

Y. Zhou, William F. Gale, T. H. North · International Materials Reviews · 1995 · 221 citations

Engineering, Materials Engineering, Materials Science +12

Isothermal solidification kinetics of diffusion brazing

W. D. MacDonald, Thomas W. Eagar · Metallurgical and Materials Transactions A · 1998 · 77 citations

Engineering, Manufacturing Engineering, Materials Engineering +14

Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding

Y. Zhou · Journal of Materials Science Letters · 2001 · 55 citations

Engineering, Materials Engineering, Materials Science +15

The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickel

Kazuyoshi Saida, Y. Zhou, T. H. North · Journal of Materials Science · 1993 · 35 citations

Engineering, Materials Engineering, Materials Science +16