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Ge p-MOSFETs With Scaled ALD $\hbox{La}_{2} \hbox{O}_{3}/\hbox{ZrO}_{2}$ Gate Dielectrics
24
Citations
32
References
2010
Year
Materials ScienceSemiconductor TechnologyElectrical EngineeringEngineeringGe P-mosfetsSurface ScienceApplied PhysicsSemiconductor MaterialThin Film Process TechnologyDielectric Thin FilmsThin FilmsAtomic Layer DepositionMicroelectronicsChemical DepositionChemical Vapor DepositionGate DielectricThin Film ProcessingSemiconductor Device
Dielectric thin films of La <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /ZrO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> deposited by atomic layer deposition (ALD) are investigated to be employed in Ge Schottky barrier p-MOSFETs. La <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> is used as a thin passivation layer and is capped by atomic-layer-deposited ZrO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> as a gate dielectric. As the gate contact TiN capped by W is applied, midgap-level trap densities of ~ 3-4 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">12</sup> eV <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> and subtreshold slopes down to 115-120 mV/dec are achieved. The devices show negative threshold voltages of -0.5 to -0.6 V, as well as peak hole mobility values of ~ 50-75 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /V · s. Equivalent oxide thickness (EOT) is reduced to 0.96 nm upon postmetallization annealing without degrading the interface properties. The results show the scaling potential of the ALD La <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> interlayer capped with ZrO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> gate dielectrics for the integration into sub-1-nm EOT Ge p-MOSFET devices.
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