Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

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Sn–Zn low temperature solder

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Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

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Development of Sn–Zn lead-free solders bearing alloying elements

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +10

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

Seongjun Kim, Sun‐Sik Kim, Katsuaki Suganuma · Journal of Electronic Materials · 2008 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +16