2012 · 40 citations · 4 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesEmbedded Memory BlocksHigh-temperature MaterialsMemory DevicesPhase ChangePhase TransitionsThermal Management MaterialsConcentrationData RetentionEmbedded MemoryHigh-temperature Thermal PropertiesMemory MaterialsPhase-change MaterialsPhase-change MemoryRetention Behavior
Phase change memory (PCRAM) is an ideal embedded memory due to its simple BEOL process and low voltage operation. Industrial and automotive applications of PCRAM, however, have not been realized because of poor high temperature properties of the conventional Ge <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> Sb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> Te <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</inf> phase-change material [1–3]. We have previously reported a special Ge <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> Sb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</inf> Te <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">z</inf> material along the Ge and Sb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> Te <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> tie line that showed superior high temperature performance. In this work we have further enhanced our previous “golden” material by incorporating nitrogen and engineering the Ge/N concentration. In order to rapidly explore a range of new materials a fast method to test retention behavior by laser melt-quenching is adopted which yields retention data on blanket films consistent with device results. A new material with special Ge/N concentration with excellent high temperature retention is discovered. The new material demonstrated nearly 100% yield in a 256 Mb test chip after 160 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">o</sup> C, 84 hrs baking, with projected 10-year retention at 120 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">o</sup> C. (> 9,000 years at 85 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">o</sup> C.)
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Full Integration of Highly Manufacturable 512Mb PRAM based on 90nm Technology
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Natural Sciences, Materials Engineering, Materials Science +16
A low power phase change memory using thermally confined TaN/TiN bottom electrode
J.Y. Wu, M. Breitwisch, Sang‐Bum Kim et al. · 2011 · 51 citations