Simulations of Solidification in Sn–3Ag–0.5Cu Alloys by the Multi-phase-field Method

Abstract

The microstructural evolutions in a Sn–3Ag–0.5Cu system of lead free alloys were predicted by the multi-phase field simulation coupled with CALPHAD thermodynamic database. In this simulation, the growth of Cu6Sn5 at 250°C and the precipitations of Cu3Sn and Ag3Sn at 150°C were calculated. These calculated micrographs were in good agreement with the experimental measurements. It was confirmed that this calculation method can be applied to the simulation of microstructures in the solidification of lead-free solder system including a Cu-substrate.