Yanghua Xia - Concepedia

Author

Yanghua Xia

Chinese Academy of Sciences

Also Known As

Xia Yang-hua, Yang-hua Xia, Yanghua Xia

Publications

221

Citations

H-Index

Concepts

All Affiliations

Chinese Academy of Sciences Shanghai Institute of Microsystem and Information Technology Huazhong University of Science and Technology China Three Gorges University

About

Yanghua Xia is an author at Chinese Academy of Sciences specializing in engineering, materials science, and corrosion.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	176
2	Materials Engineering	5	5	121
3	Applied Physics	2	2	43
4	Medicine	1	1	31
5	Cell Biology	1	1	31

Yanghua Xia

Publications

207

Citations

H-Index

Page 1

	Year	Citations
Phase evolution and microstructure characteristics of ultrafine Ti(C,N)-based cermet by spark plasma sintering Ping Feng, Weihao Xiong, YU Lixin, International Journal of Refractory Metals and Hard Materials Materials ScienceMaterials EngineeringSinteringPowder MetallurgyUltrafine Ti	2004	48
Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling Yanghua Xia, Xiaoming Xie Journal of Alloys and Compounds Materials ScienceEngineeringDurability PerformanceHardware ReliabilityCorrosion	2007	43
LncRNA ANCR promotes glioma cells invasion, migration, proliferation and inhibits apoptosis via interacting with EZH2 and repressing PTEN expression Chuandong Cheng, Yongfei Dong, Xiaoyu Ru, Cancer Gene Therapy Signaling PathwayCell RegulationGliomaMedicineApoptosis	2020	31
Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging Yanghua Xia, Xiaoming Xie, Junling Chang Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringCorrosionApplied Physics	2005	28
Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging Yanghua Xia, Xiaoming Xie, Xiaoming Xie Journal of Materials Science Materials ScienceMaterials EngineeringEngineeringCorrosionMechanical Engineering	2006	17
Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints Yanghua Xia, Junling Chang, Xiaoming Xie Journal of Electronic Materials Materials ScienceMaterials EngineeringFriction WeldingEngineeringCorrosion	2006	15
Spark plasma sintering properties of ultrafine Ti(C,N)-based cermet Feng Ping, Weihao Xiong, Yong Zheng, Journal of Wuhan University of Technology-Mater Sci Ed Materials ScienceMaterials EngineeringSinteringPowder MetallurgyUltrafine Ti	2004	13
Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests Yanghua Xia, Xiaoming Xie Journal of Electronic Materials Materials ScienceInterfacial ReactionsEngineeringDurability PerformanceCorrosion	2007	12

Page 1