Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

Engineering, Materials Engineering, Materials Science +9

Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 725 citations

Engineering, Materials Engineering, Materials Science +7

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 356 citations

Engineering, Materials Engineering, Materials Science +17