Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits - Concepedia

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Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits

11

Citations

20

References

2014

Year

W. L. Shih, Ting Yang, H. Y. Chuang, M. S. Kuo, C. R. Kao

Journal of Electronic Materials

Materials ScienceGold EmbrittlementEngineeringWafer Scale ProcessingMicrofabricationNanotechnologySurface ScienceApplied PhysicsIntegrated CircuitsElectronic PackagingMicroelectronics3D IntegrationInterconnect (Integrated Circuits)

References

	Year	Citations

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