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Determination of the critical layer thickness in the InGaN/GaN heterostructures
117
Citations
10
References
1999
Year
Materials EngineeringMaterials ScienceElectrical EngineeringPhotoluminescence EmissionCritical Layer ThicknessEngineeringPhysicsCrystalline DefectsOptical PropertiesWide-bandgap SemiconductorApplied PhysicsAluminum Gallium NitrideGan Power DeviceMultilayer HeterostructuresThin FilmsInxga1−xn/gan HeterostructureCategoryiii-v SemiconductorOptoelectronics
We present an approach to determine the critical layer thickness in the InxGa1−xN/GaN heterostructure based on the observed change in the photoluminescence emission as the InxGa1−xN film thickness increases. From the photoluminescence data, we identify the critical layer thickness as the thickness where a transition occurs from the strained to unstrained condition, which is accompanied by the appearance of deep level emission and a drop in band edge photoluminescence intensity. The optical data that indicate the onset of critical layer thickness, was also confirmed by the changes in InxGa1−xN surface morphology with thickness, and is consistent with x-ray diffraction measurements.
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