Quantitative Electron Holography of Biased Semiconductor Devices

Abstract

Electron holography is used to measure electrostatic potential profiles across reverse-biased Si p-n junctions in situ in the transmission electron microscope. A novel sample geometry based on focused ion-beam milling is developed, and results are obtained for a range of sample thicknesses and bias voltages to allow the holographic contrast to be interpreted. The physical and electrical nature of the sample surface, which is affected by sample preparation and electron beam irradiation, is discussed.