Publication | Closed Access
Lateral Overgrowth of Thick GaN on Patterned GaN Substrate by Sublimation Technique
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Citations
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References
1998
Year
Materials ScienceSio 2Electrical EngineeringSublimation TechniqueEngineeringSemiconductor TechnologyCrystalline DefectsWide-bandgap SemiconductorApplied PhysicsGan Power DevicePatterned Gan SubstrateSublimation MethodThick GanMicrostructure
The lateral overgrowth of thick GaN has been attempted using the sublimation method. The lateral overgrowth of 60 µm on SiO 2 mask, which is about three times larger than the vertical growth, was obtained by one hour of growth at 995°C, with the stripe windows in the <1100> direction of GaN. Transmission electron microscopy (TEM) shows that the extension of threading dislocations is terminated at the SiO 2 /GaN interface. The dislocation density is about 10 9 cm -2 above the window areas, and is reduced to 10 6 cm -2 in the lateral overgrowth region on SiO 2 .
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