Japanese Journal of Applied Physics · 1994 · 15 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsCarrier TransportField-effect TransistorsMetal-oxide-semiconductor Field-effect TransistorsSilicon MaterialsStrain EngineeringThin Film StrainChemical Beam EpitaxyHigh-electron-mobility TransistorsMolecular Beam EpitaxyStrain EffectsStrain Effects On Electronic PropertiesStrained Layer Structures
An enhancement-mode high-mobility p-channel metal-oxide-semiconductor field-effect-transistor (MOSFET) is fabricated on strained Si layer for the first time. A biaxially strained thin Si layer is pseudomorphically grown on a relaxed GeSi buffer on Si substrate by molecular beam epitaxy (MBE). MOSFETs are fabricated using conventional Si process technology. It is found that low-field channel mobility of PMOSFET on strained Si is 50% higher than that of PMOSFET on bulk Si.