Design of Ion-Implanted MOSFET's with Very Small Physical Dimensions

Abstract

This paper considers the design, fabrication, and characterization of very small MOSFET switching devices suitable for digital integrated circuits using dimensions of the order of 1μ. Scaling relationships are presented which show how a conventional MOSFET can be reduced in size. An improved small device structure is presented that uses ion implantation to proVide shallow source and drain regions and a nonuniform substrate doping profile. Onedimensional models are used to predict the substrate doping profile and the corresponding threshold voltage versus source voltage characteristic. A two-dimensional current transport model is used to predict the relative degree of short-channel effects for different device parameter combinations. Polysilicon-gate MOSFETs with channel lengths as short as 0.5μ were fabricated, and the device characteristics measured and compared with predicted values. I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">be</sub> performance improvement expected from using these very small devices in highly miniaturized integrated circuits is projected. Reprintedfrom the IEEE Journal of Solid-State Circuits, Vol. SC-9, October 1974, pp. 256-268.]