Concepedia

Publication | Closed Access

Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

DOI

35

Citations

4

References

1999

Year

J. P. Lucas, Fei Guo, J. L. McDougall, Thomas R. Bieler, K. N. Subramanian, J. K. Park
Journal of Electronic Materials

References

YearCitations

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