Concepedia

Edward Jih

EJ

8

Publications

182

Citations

8

H-Index

1992

Active since

Affiliations

Ford Motor Company (United States)(Current)

Edward Jih is an author at Ford Motor Company (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringElectrical EngineeringMechanics Of MaterialsMaterial ScienceSolid MechanicsThermal EngineeringHeat TransferMicrostructure

Publications per year

1992–2020

8

Publications

8

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

Y.‐H. Pao, S. Badgley, Edward Jih et al. · Journal of Electronic Packaging · 1993 · 57 citations

Materials Science, Solder Joint, High Temperature Materials +14

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, R. K. Govila, S. Badgley et al. · Journal of Electronic Packaging · 1993 · 40 citations

Engineering, Mechanical Engineering, Thermal Fatigue Fracture +20

Graphite foam for cooling of automotive power electronics

Steven B. White, Nidia C. Gallego, Daniel D. Johnson et al. · 2005 · 17 citations

Engineering, Energy Efficiency, Thermal Energy Storage +19

Vibrational fatigue of surface mount solder joints

Edward Jih, Won-Kyong Jung · 2002 · 16 citations

Engineering, Crack Propagation Event, Critical Corner Pin +16

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao · Journal of Electronic Packaging · 1995 · 15 citations

Engineering, Design Parameters, Thermal Hysteresis Response +16

Rows per page

1–5 of 8