Applied Physics Letters · 1996 · 32 citations · 0 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsInterface ScienceSemiconductor MaterialsInterface EngineeringInterfacial PhenomenaMetal-semiconductor ContactsMetalsSemiconductor InterfacesSilicon MaterialsInterfacial KineticsInterfacial Phase TransitionsInterfacial ReactionsPhase FormationReaction InterfacesSilicide ContactsSilicon InterfacesStrain Relaxation
We report the first study of interfacial reactions of a metal with Si1−x−yGexCy epitaxially grown on Si. The Ti/Si1−x−yGexCy/Si (0<y<1.7%) contact system was studied after isochronal heat treatments from 500 to 800 °C. The results for Ti/Si1−xGex phase formation agree with recent published works. However, C incorporation in the epilayer causes a dramatic decrease in strain relaxation during the Ti reaction with the epilayer, a delay in the appearance of the C54 phase, a decreased Ge concentration in the silicide–germanide phases, and carbon accumulation (probably in the form of TiC) at the silicide–germanide/epilayer interface. Also, at high annealing temperatures, a roughing of the silicide–germanide/epilayer interface was detected for the C-containing samples. A possible explanation for the reduced strain relaxation is based on mobility of dislocations.