High speed in situ depth profiling of ultrafast micromachining

Abstract

We demonstrate real-time depth profiling of ultrafast micromachining of stainless steel at scan rates of 46 kHz. The broad bandwidth and high power of the light source allows for simultaneous machining and coaxial Fourier-domain interferometric imaging of the ablation surface with depth resolutions of 6 mum. Since the same light is used to machine as to probe, spatial and temporal synchronization are automatic.