Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 492 citations

Materials Science, Engineering, Metal Nanoparticles +5

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 379 citations

Materials Science, Engineering, Mechanical Properties +5

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Kyoung‐sik Moon, Hai Dong, Radenka Marić et al. · Journal of Electronic Materials · 2005 · 378 citations

Materials Science, Engineering, Nanomaterials +9

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

Anming Hu, Jiyuan Guo, Hani Alarifi et al. · Applied Physics Letters · 2010 · 305 citations

Engineering, Metal Nanoparticles, Polymer Nanocomposites +17

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 278 citations

Materials Science, Materials Engineering, Engineering +6