Concepedia
Journal of Materials Processing Technology · 2008 · 29 citations · 16 references
EngineeringMaterials EngineeringMaterials ScienceCeramic MaterialsCeramicsSemiconductor MaterialsCeramic BondingDiffusion BondingSemiconductor Device MaterialsBonding MechanismsSilicon CarbideSilicon Carbide (Sic) MaterialsSilicon Carbide CeramicsTransient Liquid Phase Bonding
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A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations
Engineering, Materials Engineering, Materials Science +11
Solidification, structures, and properties of cast metal-ceramic particle composites
P. K. Rohatgi, Rajiv Asthana, S. Das · International Metals Reviews · 1986 · 282 citations
Engineering, Materials Engineering, Materials Science +12
TLP bonding: a new method for joining heat resistant alloys
D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations
Engineering, Materials Engineering, Materials Science +13
Effects of SiC whiskers and particles on precipitation in aluminum matrix composites
John M. Papazian · Metallurgical Transactions A · 1988 · 225 citations
Natural Sciences, Materials Engineering, Materials Science +14
Pradeep K. Rohatgi, Rajiv Asthana, S. Das · International Materials Reviews · 1986 · 88 citations