2006 · 29 citations · 2 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSensorsInfrared DetectorsIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationIntegrated PhotonicsSensor Integration3D Integrated CircuitsFocal Plane ArraysFocal Plane DetectorsHigh PerformanceParallel ProcessingParallel Signal ProcessingSilicon Infrared DetectorsThree-dimensional Integration
The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors
2