T. B. Welch

High Density, Vertical Interconnects for 3-D Integration of Silicon Integrated Circuits

Christopher A. Bower, Dean Malta, D. Temple et al. · 2006 · 48 citations

Engineering, Device Integration, Computer Architecture +23

Active infrared sensors for mobile robots

Larry Korba, S. Elgazzar, T. B. Welch · IEEE Transactions on Instrumentation and Measurement · 1994 · 45 citations

Robotic Systems, Engineering, Field Robotics +17

A Highly Sensitive Multi-element HgCdTe e-APD Detector for IPDA Lidar Applications

Jeff Beck, T. B. Welch, Pradip Mitra et al. · Journal of Electronic Materials · 2014 · 42 citations

Ipda Lidar Applications, Optoelectronics, Instrumentation

High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

D. Temple, Christopher A. Bower, Dean Malta et al. · 2006 · 29 citations

Engineering, Device Integration, Integrated Circuits +22

Bonding for 3-D Integration of Heterogeneous Technologies and Materials

D. Temple, Dean Malta, John M. Lannon et al. · ECS Transactions · 2008 · 15 citations

Engineering, Device Integration, High Density Area +21