Copper high volume manufacturing R&D to production

Abstract

In the last few years copper wire bonding has undergone a tremendous growth period. The driver behind this growth is the huge cost advantages over gold wire bonding. To achieve this, wire bonding assembly factories have invested heavily in R&D. Much of the development activity has targeted high pin count (300 -1200 I/O), finer pitch and high performance applications. Cu wire bonding has now been extended to finer pitch, lower-K and more sensitive pad structure applications, which have been considered impossible with Cu bonding in the past.