The tension of metallic films deposited by electrolysis

G. Stoney

Proceedings of the Royal Society of London Series A Containing Papers of a Mathematical and Physical Character

Crack deflection at an interface between dissimilar elastic materials

Mingyuan He, John W. Hutchinson

International Journal of Solids and Structures

EngineeringElasticity (Physics)MechanicsMechanical EngineeringDynamic Crack Propagation +5

Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films

William D. Nix, B Clemens

Journal of materials research/Pratt's guide to venture capital sources

Materials ScienceEngineeringSevere Plastic DeformationStrain LocalizationApplied Physics +7

Adhesion and debonding of multi-layer thin film structures

Reinhold H. Dauskardt, Michael Lane, Qing Ma, +1

Engineering Fracture Mechanics

Materials ScienceMaterials EngineeringEngineeringAdhesion ValuesSilicon On Insulator +12

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

P. A. Flinn, Donald S. Gardner, William D. Nix

IEEE Transactions on Electron Devices

EngineeringMechanical EngineeringFilm CompositionCold WorkingResidual Stress +19

Light extraction from organic light-emitting diodes enhanced by spontaneously formed buckles

Won Hoe Koo, Soon Moon Jeong, Fumito Araoka, +4

Nature Photonics

White OledPhotonicsElectrical EngineeringSolid-state LightingEngineering +8

Origin of Compressive Residual Stress in Polycrystalline Thin Films

Eric Chason, Brian W. Sheldon, L. B. Freund, +2

Physical Review Letters

Compressive Stress GenerationEngineeringSurface Chemical PotentialMechanical EngineeringResidual Stress +15

Mechanical characterization of PEDOT:PSS thin films

Udo Lang, Nicola Naujoks, Jürg Dual

Synthetic Metals

Materials ScienceMaterial AnalysisEngineeringMechanical CharacterizationThin Films +1

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

J. A. Floro, Sean Hearne, John Hunter, +4

Journal of Applied Physics

EngineeringGeneric Stress EvolutionStress EvolutionThin Film Process TechnologyStressstrain Analysis +18

Phase Diagram of P3HT/PCBM Blends and Its Implication for the Stability of Morphology

Jun Zhao, A. Swinnen, Guy Van Assche, +3

The Journal of Physical Chemistry B