Study of thinned Si wafer warpage in 3D stacked wafers

An Approximate Analysis of Stresses in Multilayered Elastic Thin Films

E. Suhir · Journal of Applied Mechanics · 1988 · 225 citations

Natural Sciences, Materials Engineering, Materials Science +17

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

Satyajit Walwadkar, Junghyun Cho · IEEE Transactions on Components and Packaging Technologies · 2006 · 77 citations

Engineering, Materials Engineering, Materials Science +17

Stress in polyimide coatings

John C. Coburn, Michael T. Pottiger, Susan C. Noe et al. · Journal of Polymer Science Part B Polymer Physics · 1994 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +17

Modern IC packaging trends and their reliability implications

Ralf Plieninger, Marc Dittes, K. Pressel · Microelectronics Reliability · 2006 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +14

Multi-layer thin films/substrate system subjected to non-uniform misfit strains

Xue Feng, Yonggang Huang, Ares J. Rosakis · International Journal of Solids and Structures · 2007 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +11