Publication | Closed Access
Study of thinned Si wafer warpage in 3D stacked wafers
29
Citations
9
References
2010
Year
3D Ic ArchitectureWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationApplied PhysicsSemiconductor Device FabricationElectronic PackagingSilicon On Insulator
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