Sarah Eunkyung Kim

Publications

653

Citations

H-Index

2010

Active since

Affiliations

Seoul National University of Science and Technology(Current)

Seoul National University

Sarah Eunkyung Kim is an author at Seoul National University of Science and Technology specializing in engineering, applied physics, and materials science.

ORCID

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingSurface ScienceMicroelectronicsMaterials EngineeringNanotechnology3D PrintingMicrofabrication

Publications per year

2010–2024

Publications

Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding

Haesung Park, Hankyeol Seo, Sarah Eunkyung Kim · Scientific Reports · 2020 · 70 citations · Full text

Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding

Haesung Park, Sarah Eunkyung Kim · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 66 citations

Engineering, Vacuum Device, Ar Plasma Step +18

Copper Bonding Technology in Heterogeneous Integration

Yoon-Gu Lee, Michael J. McInerney, Young‐Chang Joo et al. · Electronic Materials Letters · 2023 · 60 citations

Materials Science, Materials Engineering, Engineering +10

Wafer level Cu–Cu direct bonding for 3D integration

Sarah Eunkyung Kim, Sungdong Kim · Microelectronic Engineering · 2014 · 53 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +8

Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration

Haesung Park, Hankyeol Seo, Yoonho Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 43 citations

Engineering, Cu-cu Bonding, Plasma Processing +22

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