Sarah Eunkyung Kim - Concepedia

Author

Sarah Eunkyung Kim

Seoul National University of Science and Technology ORCID

Also Known As

Sarah Eun-Kyung Kim, Sarah EunKyung Kim, Sarah Eunkyung Kim, Sung-Dong Kim, Sungdong Kim

136

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Seoul National University of Science and Technology Seoul National University

About

Sarah Eunkyung Kim is an author at Seoul National University of Science and Technology specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	18	501
2	Applied Physics	14	16	452
3	Chemical Engineering	3	3	106
4	Law	1	1	14
5	Biomedical Engineering	1	1	35

Sarah Eunkyung Kim

Publications

653

Citations

H-Index

Page 1

	Year	Citations
Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding Haesung Park, Hankyeol Seo, Sarah Eunkyung Kim Scientific Reports	2020	70
Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding Haesung Park, Sarah Eunkyung Kim IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringVacuum DeviceAr Plasma StepPlasma ProcessingChemical Engineering	2019	66
Copper Bonding Technology in Heterogeneous Integration Yoon-Gu Lee, Michael J. McInerney, Young‐Chang Joo, Electronic Materials Letters Materials ScienceMaterials EngineeringEngineeringAdvanced Packaging (Semiconductors)Three-dimensional Heterogeneous Integration	2023	60
Wafer level Cu–Cu direct bonding for 3D integration Sarah Eunkyung Kim, Sungdong Kim Microelectronic Engineering Materials Science3D Ic ArchitectureWafer Scale ProcessingEngineeringApplied Physics	2014	53
Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration Haesung Park, Hankyeol Seo, Yoonho Kim, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringCu-cu BondingPlasma ProcessingInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2021	43
Dynamic flow measurements of capillary underfill through a bump array in flip chip package Seokhwan Lee, Jaeyong Sung, Sarah Eunkyung Kim Microelectronics Reliability EngineeringFlip Chip PackageMicrofabricationFluid MechanicsDynamic Flow Measurements	2010	35
Study of thinned Si wafer warpage in 3D stacked wafers Youngrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim Microelectronics Reliability 3D Ic ArchitectureWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2010	29
Structural, electrical, and optical properties of reactively sputtered SnO2 thin films Sarah Eunkyung Kim, Manny Oliver Metals and Materials International Materials ScienceSno2 Thin FilmsOptical MaterialsEngineeringMaterial Analysis	2010	28
Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material Dongho Shin, Sungjun Choi, Sarah Eunkyung Kim, Applied Surface Science Materials ScienceGraphene NanomeshesEngineeringCarbon-based MaterialNanomaterials	2022	21
Effects of forming gas plasma treatment on low-temperature Cu–Cu direct bonding Sungdong Kim, Youngju Nam, Sarah Eunkyung Kim Japanese Journal of Applied Physics Materials ScienceMaterials EngineeringChemical EngineeringCu OxideEngineering	2016	20

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