Haesung Park

Statistics

Publications

Citations

237

H-Index

Active since

2018

Affiliations

Seoul National University of Science and Technology(Current)

Haesung Park is an author at Seoul National University of Science and Technology specializing in materials engineering, materials science, and plasma surface treatment.

ORCID

Publications per year

2018–2021

Publications

Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding

Haesung Park, Hankyeol Seo, Sarah Eunkyung Kim · Scientific Reports · 2020 · 77 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Two-Step Plasma Treatment on Copper Surface for Low-Temperature Cu Thermo-Compression Bonding

Haesung Park, Sarah Eunkyung Kim · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +16

Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration

Haesung Park, Hankyeol Seo, Yoonho Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +16

Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding

Hankyeol Seo, Haesung Park, Sarah Eunkyung Kim · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 20 citations

Engineering, Materials Engineering, Materials Science +17

Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application

Haesung Park, Sarah Eunkyung Kim · Microsystem Technologies · 2018 · 12 citations

Engineering, Materials Engineering, Materials Science +17

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