A 160×120-pixel uncooled IR-FPA readout integrated circuit with on-chip non-uniformity compensation

Abstract

This paper describes the development of a readout integrated circuit coupled to a 160×120-pixels infrared focal plane array (IR-FPA) based on micro-bolometric detectors. The readout circuit includes 5-bit in-pixel memory and dedicated circuitry for automatic calibration of the array offset non-uniformity, 8 selectable columns of reference pixels, and four high-sensitivity temperature sensors to monitor FPA temperature. The integrated circuit has been fabricated in a standard CMOS 0.5μm 2P3M 3.3/5V technology and subsequently processed to build the vanadium oxide bolometers having a pitch of 52μm. Electrical and electro-optical tests have been performed: the chip operates at 50fps with NETD=0.33K (dynamic vacuum, optics with F/#=1.2) dissipating 80mW, with up to 32x offset reduction.