Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2008 · 20 citations · 0 references
EngineeringBioengineeringMicrofabricationPhotonicsSensorsInfrared DetectorsInfrared InstrumentationMedical Imaging InstrumentationNear-infrared ImagingFar-infrared ImagingMicrobolometer ArraysMicrobolometersPixel ArchitectureThermal ImagingThermal Imaging SensorsThermal Infrared Imaging
BAE Systems has advanced its 17 μm pitch LWIR 640 x 480 microbolometer technology with improvements in pixel performance and introduction of a new 17 μm pitch ROIC. We have fabricated, characterized, and demonstrated high-yielding 17 μm pitch FPAs using our new ROIC, and have successfully demonstrated them at the system level. This new technology builds on our 28 μm FPA production experience and implements our high-performance single-level microbolometer process at 17 μm pitch. We present initial results and imagery. These 17 μm FPAs have exceptional performance and provide the path to next generation microbolometer applications.