Reactive oxygen beam generation system using pulsed laser evaporation of highly concentrated solid ozone

Abstract

A reactive oxygen beam generation system is described for the formation of high-quality and high-precision films. This system utilizes pulsed laser evaporation of highly concentrated solidified ozone (O3). The equipment for safely generating and handling a large amount of high-purity liquid and solid O3 was also developed for this purpose. The beam is characterized by its high concentration of oxygen atoms in an excited state [O(1D)], constant flux per laser shot (4×1017 molecules cm−2 shot−1), appropriate level of kinetic energy (KE) for enhancing the surface reaction (mean KE of 0.4 eV, maximum KE of 2 eV) and small angular spread (6°). These characteristics enabled us to precisely control the SiO2 film thickness by the number of laser shots, and achieve an enhanced Si oxidation rate and new local oxidation process.