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Thin film deposition using low-energy ion beams. I. System specification and design
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1976
Year
EngineeringCarbon SubstratesThin Film Process TechnologyChemical DepositionIon ImplantationDeposition EnergyIon BeamThin Film ProcessingMaterials ScienceMaterials EngineeringElectrical EngineeringThin-film FabricationLow-energy Ion BeamsMicroelectronicsThin Film DepositionDesign CriteriaMicrofabricationSurface ScienceApplied PhysicsThin FilmsChemical Vapor DepositionSystem Specification
Design criteria for a clean thin film deposition facility are discussed. A low-energy ion beam film deposition system satisfying the design requirements has been constructed. Initial performance data are given for gaseous ion beams and for several ion beam-deposited elemental metallic films. The facility has numerous features built in to allow a wide range of diagnostic tests to be carried out on films produced within the system, both in situ and in external equipment such as electron microscopes and Rutherford backscattering analysis. A deposition energy between 70 and 75 eV is suggested as an optimum energy range for deposition of Pb+ and Mg+ onto carbon substrates.