3D microstructuring of Pyrex glass using the electrochemical discharge machining process

Zhi-Ping Zheng, Wei-Hsin Cheng, Fuang-Yuan Huang, Biing-Hwa Yan

Journal of Micromechanics and Microengineering · 2007 · 146 citations · 27 references

Concepts

TL;DR

Electrochemical discharge machining (ECDM) shows promise for 3D microstructuring of Pyrex glass, yet achieving higher machining accuracy remains a critical challenge. This study aimed to enhance ECDM micromilling quality by conducting microgroove machining experiments. The experiments varied pulse voltage, tool rotational rate, and tool travel rate to assess their effects on micromilling performance. Optimal combinations of pulse voltage and tool rotational rate improved machining accuracy, and layer‑by‑layer ECDM micromilling successfully produced complex 3D microstructures, demonstrating the process’s potential.

Abstract

Electrochemical discharge machining (ECDM) is demonstrated to be a potential process for 3D microstructuring of Pyrex glass. However, the key to widening ECDM micromilling applications lies in how to improve the machining accuracy. To improve the machining quality of the ECDM micromilling process, microgroove machining experiments were conducted in this study. Three factors affecting ECDM micromilling performance—pulse voltage, tool rotational rate and travel rate of tool—were taken up as machining parameters to investigate their influences on machining performance. The results indicate that optimum combinations of both pulse voltage and tool rotational rate will realize better machining accuracy. The feasibility of three-dimensional microstructure machining was demonstrated by layer-by-layer ECDM micromilling machining. Complex structures were made to demonstrate the great potential for the 3D microstructuring of Pyrex glass of the ECDM micromilling process.

References

27