Concepedia

Study of damage and stress induced by backgrinding in Si wafers

Jian Chen, Ingrid De Wolf

Semiconductor Science and Technology · 2003 · 108 citations · 3 references

DOI

Concepts

Abstract

In this paper, a study of subsurface damage induced by backgrinding Si wafers is presented.

References

3

The tension of metallic films deposited by electrolysis

G. Stoney · Proceedings of the Royal Society of London Series A Containing Papers of a Mathematical and Physical Character · 1909 · 4.8K citations · Full text

, , +11

Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits

Ingrid De Wolf · Semiconductor Science and Technology · 1996 · 970 citations

, , +17

Raman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces

Jian Chen, Ingrid De Wolf · 2003 · 11 citations

, , +17