Surface and Interface Analysis · 2002 · 35 citations · 6 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials CharacterizationSurface ChemistryThin FilmsMetal OxidesSurface OxidationSurface PhysicsThin Film OxidationActivation EnergyGrazing-incidence X-ray DiffractionMetal Thin FilmsMetallic Thin FilmsOxidation KineticsOxidation-reduction KineticsReflectometryThin Film Oxidation Kinetics
Abstract Oxide formation on magnetron‐sputtered thin copper films (35 nm thickness) was studied by x‐ray reflectometry and grazing incidence x‐ray diffraction. The films were oxidized in air at temperatures of 175° C, 200° C, 225° C and 250° C. The reflectometry and the diffractometry data indicate the formation of Cu 2 O. A power‐law dependence of the oxide layer thickness was found. The activation energy obtained is weakly time dependent. Copyright © 2002 John Wiley & Sons, Ltd.
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